Semiconductor device

ABSTRACT

A semiconductor device includes a semiconductor layer made of SiC. A transistor element having an impurity region is formed in a front surface portion of the semiconductor layer. A first contact wiring is formed on a back surface portion of the semiconductor layer, and defines one electrode electrically connected to the transistor element. The first contact wiring has a first wiring layer forming an ohmic contact with the semiconductor layer without a silicide contact and a second wiring layer formed on the first wiring layer and having a resistivity lower than that of the first wiring layer.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. application Ser. No.15/931,515, filed on May 13, 2020, entitled SEMICONDUCTOR DEVICE (Atty.Dkt. No. ROHM61-34917), which is a continuation of U.S. application Ser.No. 15/816,481, filed on Nov. 17, 2017, entitled SEMICONDUCTOR DEVICE,now U.S. Pat. No. 10,693,001, issued on Jun. 23, 2020 (Atty. Dkt. No.ROHM61-34371), which is a continuation of U.S. application Ser. No.15/220,367, filed on Jul. 26, 2016, now U.S. Pat. No. 9,837,531, issuedon Dec. 5, 2017, which is a continuation of U.S. application Ser. No.14/493,715, filed on Sep. 23, 2014 (now U.S. Pat. No. 9,406,757, issuedon Aug. 2, 2016), which is a continuation of U.S. application Ser. No.13/366,966, filed on Feb. 6, 2012 (now U.S. Pat. No. 8,872,263, issuedon Oct. 28, 2014), which is a divisional of U.S. application Ser. No.12/654,620, filed on Dec. 24, 2009 (now U.S. Pat. No. 8,188,538, issuedon May 29, 2012). Furthermore, this application claims the benefit ofpriority of Japanese application serial numbers 2008-330318, filed onDec. 25, 2008, 2008-334480, filed on Dec. 26, 2008 and 2009-293362,filed on Dec. 24, 2009. The disclosures of these prior U.S. and Japaneseapplications are incorporated herein by reference.

BACKGROUND OF THE INVENTION Field of the Invention

The present invention relates to a semiconductor device employing SiCand a method of manufacturing the same.

Description of Related Art

In recent years, employment of SiC (silicon carbide) as thenext-generation power device material implementing low on-resistance hasbeen examined.

A trench gate structure is known as a structure for refining a powerdevice and reducing on-resistance. For example, a power MOSFET employingthe trench gate structure is increasingly forming the mainstream.

FIG. 11 is a schematic sectional view of a conventional semiconductordevice having a trench gate VDMOSFET employing SiC.

A semiconductor device 201 has a structure obtained by arranging aplurality of unit cells of a trench gate VDMOSFET in the form of amatrix.

The semiconductor device 201 includes an N⁺-type SiC substrate 202forming the base of the semiconductor device 201. An N⁻-type epitaxiallayer 203 made of SiC (silicon carbide) doped with an N-type impurity ina lower concentration than the SiC substrate 202 is laminated on an Sisurface (a silicon surface) of the SiC substrate 202. A base layerportion of the epitaxial layer 203 forms an N⁻-type drain region 204maintaining a state after epitaxy. In the epitaxial layer 203, a P-typebody region 205 is formed on the drain region 204 in contact with thedrain region 204.

A gate trench 206 is dug down in the epitaxial layer 203 from a surface217 (an Si surface) thereof. The gate trench 206 passes through the bodyregion 205 in the thickness direction, and the deepest portion (a bottomsurface 216) thereof reaches the drain region 204.

In the gate trench 206, a gate insulating film 207 made of SiO₂ isformed on the overall regions of the inner surfaces of the gate trench206 by thermally oxidizing side surfaces 214 and the bottom surface 216of the gate trench 206.

A gate electrode 208 is embedded in the gate trench 206 by filling upthe inner side of the gate insulating film 207 with a polysiliconmaterial doped with an N-type impurity in a high concentration.

On a surface layer portion of the epitaxial layer 203, N⁺-type sourceregions 209 are formed on both sides of the gate trench 206 in adirection (the right-and-left direction in FIG. 11) orthogonal to thegate width. The source regions 209 extend along the gate trench 206 in adirection along the gate width, and bottom portions thereof are incontact with the body region 205 from the side of the surface 217 of theepitaxial layer 203.

The epitaxial layer 203 is further provided with P⁺-type body contactregions 210 passing through central portions of the source regions 209in the direction orthogonal to the gate width from the surface 217thereof to be connected to the body region 205.

An interlayer dielectric film 211 made of SiO₂ is laminated on theepitaxial layer 203. A source wire 212 is formed on the interlayerdielectric film 211. The source wire 212 has a nickel silicide layer 218in contact with the source regions 209 and the body contact regions 210through a contact hole 213 formed in the interlayer dielectric film 211and an aluminum layer 219 formed on the nickel silicide layer 218.

A drain wire 215 is formed on the rear surface (a carbon surface: a Csurface) of the SiC substrate 202. The drain wire 215 has a nickelsilicide layer 220 in contact with the SiC substrate 202 and an aluminumlayer 221 formed on the nickel silicide layer 220.

A prescribed voltage (a voltage of not less than a gate thresholdvoltage) is applied to the gate electrode 208 while a prescribedpotential difference is caused between the source wire 212 and the drainwire 215 (between a source and a drain), whereby a channel is formed inthe vicinity of the interface between the body region 205 and the gateinsulating film 207 due to an electric field from the gate electrode208. Thus, a current flows between the source wire 212 and the drainwire 215, and the VDMOSFET is turned on.

SUMMARY OF THE INVENTION

The surface 217 of the epitaxial layer 203 is the Si surface, and hencethe bottom surface 216 of the gate trench 206 dug down from the surface217 is also an Si surface.

When the gate insulating film 207 is formed by dry oxidation or wetoxidation, therefore, the ratio (oxidation rate for bottom surface216/oxidation rate for side surface 214) of the oxidation rate for thebottom surface 216 to that for the side surfaces 214 is 0.2 or less. Inthe gate insulating film 207, therefore, the thickness of a portionlocated on the bottom surface 216 is smaller than that of portionslocated on the side surfaces 214.

When the VDMOSFET is turned off in the semiconductor device 201, on theother hand, a high potential difference is caused between the gateelectrode 208 and the drain wire 215 (between a gate and a drain), andan electric field concentrates on the bottom surface 216 of the gatetrench 206. When the portion of the gate insulating film 207 located onthe bottom surface 216 has a small thickness as described above,dielectric breakdown is easily caused due to the concentration of theelectric field.

Therefore, the thickness of the portion located on the bottom surface216 may be increased by lengthening the oxidation time for forming thegate insulating film 207. However, oxidation of the side surfaces 214progresses in parallel with the oxidation of the bottom surface 216, andhence the thickness of the portions located on the side surfaces 214 isremarkably increased due to the aforementioned difference between theoxidation rates.

An object of the present invention is to provide a semiconductor devicecapable of suppressing dielectric breakdown of a portion located on thebottom surface of a gate trench while suppressing increase in thethickness of portions located on the side surfaces of the gate trenchand a method of manufacturing the same.

The foregoing and other objects, features and effects of the presentinvention will become more apparent from the following detaileddescription of the embodiments with reference to the attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic sectional view of a semiconductor device accordingto a first embodiment of the present invention.

FIGS. 2A to 2N are schematic sectional views for illustrating a methodof manufacturing the semiconductor device shown in FIG. 1 in step order.

FIGS. 3A and 3B are schematic plan views of a semiconductor deviceaccording to a second embodiment of the present invention, with FIG. 3Ashowing the overall semiconductor device and FIG. 3B showing an innerportion thereof in an enlarged manner.

FIG. 4 is a schematic sectional view of the semiconductor deviceaccording to the second embodiment of the preset invention, taken alonga line IV-IV in FIG. 3B.

FIGS. 5A to 5U are schematic sectional views for illustrating a methodof manufacturing the semiconductor device shown in FIG. 4 in step order.

FIG. 6 is a graph showing temperature changes in a resistance heatingfurnace.

FIG. 7 is a schematic sectional view for illustrating a modification ofthe semiconductor device shown in FIG. 4.

FIG. 8 is a schematic sectional view of a planar gate semiconductordevice.

FIGS. 9A to 9L are schematic sectional views for illustrating a methodof manufacturing the semiconductor device shown in FIG. 8 in step order.

FIGS. 10A, 10B and 10C are graphs of thicknesses of oxide films plottedevery feeding time for oxidizing gas in Example 1, comparative example 1and comparative example 2 respectively.

FIG. 11 is a schematic sectional view of a conventional semiconductordevice having a trench gate VDMOSFET employing SiC.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

A semiconductor device according to an embodiment of the presentinvention includes: a semiconductor layer of a first conductivity typemade of SiC having an Si surface; a gate trench dug down from thesurface of the semiconductor layer; a gate insulating film formed on abottom surface and a side surface of the gate trench so that the ratioof the thickness of a portion located on the bottom surface to thethickness of a portion located on the side surface is 0.3 to 1.0; and agate electrode embedded in the gate trench through the gate insulatingfilm.

According to the structure, the gate trench is dug down from the surfaceof the semiconductor layer of the first conductivity type made of SiChaving the Si surface. The gate insulating film is formed on the bottomsurface and the side surface of the gate trench. The gate electrode isembedded in the gate trench through the gate insulating film.

Thus, a trench gate MOSFET having such a MOS (Metal Oxide Semiconductor)structure that the gate electrode (Metal) is opposed to thesemiconductor layer (Semiconductor) through the portion (Oxide) of thegate insulating film located on the side surface of the gate trench isformed in the semiconductor device.

In the MOSFET, the ratio of the thickness of the portion of the gateinsulating film located on the bottom surface to the thickness of theportion located on the side surface is 0.3 to 1.0. Even if the thicknessof the portion located on the bottom surface is increased so thatdielectric breakdown can be suppressed, excessive increase in thethickness of the portion located on the side surface can be suppresseddue to the lower limit of 0.3 of the ratio (thickness of portion locatedon bottom surface/thickness of portion located on side surface). Whenthe thickness of the portion located on the bottom surface is designedto a proper value, on the other hand, the thickness of the portionlocated on the side surface is not excessively reduced, due to the upperlimit of 1.0. Consequently, dielectric breakdown of the portion locatedon the bottom surface can be suppressed while suppressing increase inthe thickness of the portion located on the side surface by properlydesigning the thickness of the portion located on the bottom surface.

Preferably, the semiconductor device further includes a body region of asecond conductivity type formed in the semiconductor layer on a sideportion of the gate trench and in contact with the gate insulating filmon the side surface of the gate trench and a source region of a firstconductivity type formed on a surface layer portion of the body regionadjacently to the gate trench, and the gate insulating film containsnitrogen.

According to the structure, the body region of the second conductivitytype in contact with the gate insulating film on the side surface of thegate trench is formed in the semiconductor layer on the side portion ofthe gate trench. On the surface layer portion of the body region, thesource region of the first conductivity type is formed adjacently to thegate trench. In the trench gate MOSFET in the semiconductor device,therefore, a portion in the vicinity of the interface between the bodyregion and the gate insulating film is a channel portion in which achannel is formed due to an electric field from the gate electrode. Inthe semiconductor device, the gate insulating film contains nitrogen,whereby channel mobility of the MOSFET can be improved.

Preferably in the semiconductor device, the concentration of an impurityof the second conductivity type in the body region is not more than 10¹⁹cm⁻³.

If the impurity concentration in the body region on the side portion ofthe gate trench is in excess of 10¹⁹ cm⁻³, the side surface of thetrench is oxidized at a relatively extremely high oxidation rate withrespect to the bottom surface of the trench when the bottom surface andthe side surface of the gate trench are oxidized, and the portion of thegate insulating film located on the side surface is remarkablythickened.

When the impurity concentration in the body region is not more than 10¹⁹cm⁻³, on the other hand, the ratio of the oxidation rate for the sidesurface of the trench to the oxidation rate for the bottom surface ofthe trench can be maintained at a proper value when the bottom surfaceand the side surface of the gate trench are oxidized. Consequently,increase in the thickness of the portion of the gate insulating filmlocated on the side surface can be suppressed.

Preferably, the semiconductor device further includes an implantationlayer formed by implantation of an impurity in a portion of thesemiconductor layer reaching an intermediate portion of thesemiconductor layer in the thickness direction from the bottom surfaceof the gate trench.

The implantation layer is so formed immediately under the bottom surfaceof the gate trench that the ratio of the thickness of the portion of thegate insulating film located on the bottom surface to the thickness ofthe portion located on the side surface can be set to 0.3 to 1.0 byoxidizing the bottom surface of the trench at a relatively highoxidation rate with respect to the side surface of the trench when thebottom surface and the side surface of the gate trench are oxidizedafter the formation of the implantation layer.

Preferably, the implantation layer is formed by implantation of animpurity of the second conductivity type.

When the implantation layer is formed by implantation of the impurity ofthe second conductivity type different from the conductivity type of thesemiconductor layer, an energy barrier formed between the implantationlayer and the semiconductor layer can be enlarged. Therefore, a currentcan be rendered hardly flowable to the implantation layer. Consequently,the electric field concentration on the bottom surface of the gatetrench can be suppressed.

Preferably in the semiconductor device, the thickness of the portion ofthe gate insulating film located on the side surface of the gate trenchis not more than 2000 Å.

If the thickness of the portion located on the side surface of the gatetrench is in excess of 2000 Å, the semiconductor device must be operatedwith a high gate-on voltage (about 20 V, for example), and an efficienttransistor operation may not be executable.

When the thickness of the portion located on the side surface of thegate trench is not more than 2000 Å, on the other hand, thesemiconductor device can be operated with a proper gate-on voltage, andan efficient transistor operation can be achieved.

Preferably, an end portion of the bottom portion of the gate trench in adirection orthogonal to the gate width is bent outward.

According to the structure, the end portion of the bottom portion of thegate trench on which an electric field easily concentrates at a turn-offtime is so bent that the electric field applied to the end portion canbe dispersed to portions other than the end portion. Consequently,dielectric breakdown of the portion of the gate insulating film locatedon the bottom surface can be suppressed.

Preferably, the semiconductor device further includes a source wireformed on the semiconductor layer and in contact with the source region,and the source wire has a polysilicon layer in the portion in contactwith the source region, and has a metal layer on the polysilicon layer.

In order to form the source wire 212 in the semiconductor device 201shown in FIG. 11, for example, Ni is first deposited by sputtering onthe surfaces (the surfaces of the source regions 209 and the bodycontact regions 210) of regions (impurity regions) of the epitaxiallayer 203 doped with impurities. Then, Ni is silicified by reacting withSi contained in SiC through a heat treatment at a high temperature(about 1000° C., for example), to be brought into ohmic contact with theimpurity regions. Thus, the nickel silicide layer 218 is formed.Thereafter Al is deposited on the nickel silicide layer 218 bysputtering. Thus, the aluminum layer 219 is formed, to form the sourcewire 212.

When the nickel silicide layer 218 is formed, however, carbon (C)remaining in SiC is deposited on the surface of the nickel silicidelayer 218 and in the vicinity of the interface between the nickelsilicide layer 218 and the impurity regions, to form a carbon layercontaining a large quantity of C. The carbon layer is so poor inadhesiveness to a metal or SiC that the nickel silicide layer 218 iseasily peeled from the aluminum layer 219 or the impurity regions.

Preferably in the semiconductor device, therefore, the source wirebrought into contact with the source region has the polysilicon layer inthe portion in contact with the source region, and has the metal layeron the polysilicon layer.

Polysilicon can form excellent ohmic contact with the region (theimpurity region) of SiC doped with the impurity. Therefore,silicification indispensable for a structure having a metal layerdirectly in contact with a source region can be omitted. Thus, formationof a carbon layer can be prevented on the surface of the polysiliconlayer and in the vicinity of the interface between the polysilicon layerand the source region. Consequently, layer peeling can be suppressedbetween the polysilicon layer and the metal layer as well as between thepolysilicon layer and the source region. Thus, connection reliability ofthe source wire can be improved.

Preferably in the semiconductor device, an intermediate layer containingTi is interposed between the polysilicon layer and the metal layer.

A material containing titanium has excellent adhesiveness with respectto both of a polysilicon material and a metal material. In thesemiconductor device having the layer containing titanium interposedbetween the polysilicon layer and the metal layer, therefore,adhesiveness between the polysilicon layer and the metal layer can beimproved. Consequently, the connection reliability of the contact wirecan be further improved.

Preferably in the semiconductor device, the metal layer has a layercontaining Al, and the intermediate layer has a structure obtained bylaminating a Ti layer and a TiN layer in this order from the side of thepolysilicon layer.

While Al can be utilized as an impurity for providing the polysiliconlayer with conductivity, the resistance of the polysilicon layerutilized as the source wire may be unstabilized unless Al is mixed intothe polysilicon layer in a proper quantity.

In the structure of the semiconductor device, therefore, the TiN layeris interposed between the layer containing Al and the polysilicon layer,as a barrier layer for preventing diffusion of Al into the polysiliconlayer. Thus, no excessive Al diffuses into the polysilicon layer,whereby the impurity concentration in the polysilicon layer can bestabilized. Consequently, the resistance of the polysilicon layer can bestabilized.

A method of manufacturing a semiconductor device according to theembodiment of the present invention includes the steps of: forming agate trench on a surface layer portion of a semiconductor layer of afirst conductivity type made of SiC having an Si surface to be dug downfrom the surface; forming a gate insulating film on a bottom surface anda side surface of the gate trench by oxidizing the bottom surface andthe side surface of the gate trench in gas containing nitrogen andoxygen at a heat treatment temperature of not less than 1200° C.; andforming a gate electrode on the gate insulating film to fill up the gatetrench.

When the bottom surface and the side surface of the gate trench areoxidized under the conditions (the atmosphere gas and the heat treatmenttemperature) in the method, the ratio of the thickness of a portion ofthe gate insulating film located on the bottom surface to the thicknessof a portion located on the side surface can be set to 0.3 to 1.0.

Preferably, the bottom surface and the side surface of the gate trenchare oxidized in gas containing at least N₂O in the step of forming thegate insulating film, and N₂O gas is fed at a flow rate of not more than30% with respect to the total flow rate of fed gas in the step offorming the gate insulating film.

The step of forming the gate insulating film may include the steps ofcharging the semiconductor layer into a resistance heating furnace,producing a nitrogen-and-oxygen-containing gas atmosphere by introducinggas containing nitrogen and oxygen into the resistance heating furnace,and controlling the heating temperature in the resistance heatingfurnace to not less than 1200° C. while maintaining the gas atmosphere.

The following is known as the background technique related to heating ofa semiconductor layer made of SiC, for example:

More specifically, a MOSFET having a MOS (Metal Oxide Semiconductor)structure formed by an SiC layer having an activated ion region on asurface layer portion thereof, a gate oxide film formed on the surfaceof the SiC layer and a gate electrode formed on the gate oxide film andopposed to the ion region through the gate oxide film, for example, isknown as a semiconductor device employing SiC.

In order to prepare such a MOS structure, impurity ions are firstimplanted into the surface layer portion of the SiC layer, for example.Then, the SiC layer is heated in a resistance heating furnace, wherebythe implanted ions are activated. After the activation of the ions, thegate oxide film is formed on the surface of the SiC layer by feedingoxygen-containing gas in a CVD (Chemical Vapor Deposition) apparatus.Then, the gate electrode is formed on the gate oxide film by sputtering.Thus, a layered structure (the MOS structure) of the gate electrode(Metal), the gate oxide film (Oxide) and the SiC layer (Semiconductor)is produced.

In order to activate the ions in the SiC layer, the SiC layer must beannealed at a temperature of 1600 to 1700° C., for example. In theresistance heating furnace, it takes a long time to heat the SiC layerup to a high temperature range, and hence Si sublimates from the surfaceof the SiC layer by the so-called Si escape, to roughen the surface ofthe SiC layer. Consequently, the interface between the SiC layer and thegate oxide film is irregularized, to reduce channel mobility of theMOSFET.

Therefore, a technique of suppressing surface roughening of the SiClayer by utilizing a high-frequency induction heater for reducing thetime for heating the SiC layer up to the high temperature range andthereafter forming the gate oxide film through a gate oxidation furnaceis employed.

However, such a technique separately requires two apparatuses, i.e., thehigh-frequency induction heater and the gate oxidation furnace, andhence the device cost is disadvantageously increased.

Another technique of forming a carbon film on the surface of the SiClayer in advance of the activation of the ions and preventing the Siescape with the carbon film thereby maintaining planarity on the surfaceof the SiC layer is proposed.

The carbon film is prepared by forming a film containing carbon on thesurface of the SiC layer and heating the film containing carbon in thehigh-frequency induction heater thereby evaporating elements other thancarbon from the film, for example.

According to studies made by the inventors, however, a heatingtemperature for forming the carbon film may be about 1000° C., which islower than the temperature (1600 to 1700° C.) for activating the ions.Therefore, the heating temperature must be controlled in two stages,while it has been recognized difficult to precisely temperature-controlthe high-frequency induction heater.

After the activation of the ions, the carbon film is no longer required.The unrequited carbon film is oxidized and removed with oxidizing gas inan apparatus different from the high-frequency induction heater. Whilethe oxidizing gas may be introduced into the high-frequency inductionheater to remove the carbon film subsequently to the activation of theions, a carbon material is used for a heating element of thehigh-frequency induction heater and hence the carbon material isoxidized when fed with the oxidizing gas. Therefore, a carbon filmremoving apparatus is inevitably additionally required, to unavoidablyincrease the device cost.

In order to attain an object of providing a method of manufacturing asemiconductor device capable of suppressing roughening on the surface ofan SiC layer through simple temperature control without increasing thedevice cost, the inventors have provided the following invention:

More specifically, the method of manufacturing a semiconductor deviceaccording to the invention includes the steps of forming an organicmaterial film on the surface of an SiC layer having a surface layerportion into which ions have been implanted, altering the organicmaterial film into a carbon film by heating the organic material in aresistance heating furnace after the formation of the organic materialfilm, activating the ions in the SiC layer by heating the SiC layerprovided with the carbon film in the resistance heating furnace,oxidizing and removing the carbon film by introducing oxygen-containinggas into the resistance heating furnace, and forming an oxide film byoxidizing the surface of the SiC layer with the oxygen-containing gas inthe resistance heating furnace continuously after the removal of thecarbon film.

According to the method, the organic material film is heated in theresistance heating furnace after the formation of the organic materialfilm, whereby the organic material film is altered into the carbon film,and the carbon film is formed on the surface of the SiC layer. After theformation of the carbon film, the SiC layer is heated in order toactivate the ions in the SiC layer. Thereafter the carbon film isoxidized and removed by introducing the oxygen-containing gas into theresistance heating furnace. After the removal of the carbon film, thesurface of the SiC layer is oxidized with the oxygen-containing gascontinuously in the resistance heating furnace, so that the surface ofthe SiC layer is oxidized with the oxygen-containing gas and the oxidefilm is formed.

The carbon film is formed on the surface of the SiC layer in advance ofthe heating for activating the ions, whereby Si escape from the surfaceof the SiC layer can be prevented when the SiC layer is heated.Therefore, roughening on the surface of the SiC layer can be suppressed,and planarity on the surface of the SiC layer can be maintained.Consequently, the interface between the SiC layer and the oxide film canbe smoothed, whereby channel mobility of the semiconductor device can beimproved.

Further, the four steps of altering the organic material film into thecarbon film by heating the same, activating the ions by heating the SiClayer, oxidizing and removing the carbon film with the oxygen-containinggas, and forming the oxide film by oxidizing the surface of the SiClayer can be continuously carried out in a single resistance heatingfurnace. No apparatus for removing the carbon film or the like isadditionally required, whereby increase in the device cost can also besuppressed. Further, the resistance heating furnace is so employed thatthe heating temperature for forming the carbon film and that foractivating the ions can be precisely and simply controlled.

The oxygen-containing gas may be gas containing oxygen and nitrogen.When the oxygen-containing gas for forming the oxide film containsoxygen and nitrogen, the channel mobility of the semiconductor devicecan be further improved.

Gas containing NO (nitrogen monoxide), N₂O (dinitrogen oxide) or thelike, for example, can be employed as the gas containing oxygen andnitrogen.

Preferably, the surface of the SiC layer is defined by a (0001) plane,i.e., an Si surface.

As hereinabove described, the inventors have provided the inventionutilizing the resistance heating furnace as the invention related toheating of the semiconductor layer made of SiC.

When the step of forming the gate insulating film includes the steps ofcharging the semiconductor layer into a resistance heating furnace,producing a nitrogen-and-oxygen-containing gas atmosphere by introducinggas containing nitrogen and oxygen into the resistance heating furnace,and controlling the heating temperature in the resistance heatingfurnace to not less than 1200° C. while maintaining the gas atmosphere,therefore, functions/effects of the aforementioned invention utilizingthe resistance heating furnace can be attained in addition to those ofthe present invention.

Embodiments of the present invention are now described in detail withreference to the attached drawings.

FIG. 1 is a schematic sectional view of a semiconductor device accordingto a first embodiment of the present invention.

A semiconductor device 1 has a structure obtained by arranging aplurality of unit cells of a trench gate VDMOSFET in the form of amatrix. FIG. 1 shows only part of the plurality of unit cells.

The semiconductor device 1 includes an SiC substrate 2 forming the basethereof. The SiC substrate 2 is doped with an N-type impurity in a highconcentration (10¹⁸ to 10²¹ cm⁻³, for example). The SiC substrate 2 hasa surface 21 (an upper surface) formed by an Si surface and a rearsurface (a lower surface) 22 formed by a C surface.

An N⁻-type epitaxial layer 3 made of SiC (silicon carbide) doped with anN-type impurity in a lower concentration than the SiC substrate 2 islaminated on the surface 21 of the SiC substrate 2. The epitaxial layer3 as a semiconductor layer is formed on the SiC substrate 2 by theso-called epitaxy. The epitaxial layer 3 formed on the surface 21, i.e.,the Si surface, is grown on a major growth surface formed by an Sisurface. Therefore, a surface 31 of the epitaxial layer 3 formed by thegrowth is an Si surface, similarly to the surface 21 of the SiCsubstrate 2.

A portion (a base layer portion) on the side of the C surface of theepitaxial layer 3 opposite to a portion (a surface layer portion) on theside of the Si surface forms an N⁻-type drain region 4 entirelymaintaining the state after the epitaxy. The drain region 4 has anN-type impurity concentration of 10¹⁵ to 10¹⁷ cm⁻³, for example.

On the other hand, a P-type body region 5 is formed on the surface layerportion of the epitaxial layer 3. The body region 5 is in contact withthe drain region 4 from the side (the Si surface side) of the surface 31of the epitaxial layer 3. The body region 5 has a P-type impurityconcentration of 10¹⁶ to 10¹⁹ cm⁻³, for example.

A gate trench 6 is dug down in the epitaxial layer 3 from the surface 31thereof. A plurality of such gate trenches 6 (not shown in FIG. 1) areformed at regular intervals to parallelly extend in the same direction(a direction orthogonal to the plane of FIG. 1: the direction mayhereinafter be referred to as a “direction along the gate width”),thereby forming a striped structure, for example.

Each gate trench 6 has a pair of planar side surfaces 7 opposed to eachother at an interval and orthogonal to the surface 31 respectively and abottom surface 8 having a portion parallel to the surface 31. The gatetrench 6 passes through the body region 5 in the thickness direction,and the deepest portion (the bottom surface 8) thereof reaches the drainregion 4.

A gate insulating film 9 is formed on the inner surfaces of the gatetrench 6 and the surface 31 of the epitaxial layer 3, to cover theoverall regions of the inner surfaces (the side surfaces 7 and thebottom surface 8) of the gate trench 6. The gate insulating film 9consists of an oxide film containing nitrogen, such as a siliconoxynitride film formed by thermal oxidation with nitrogen-containinggas, for example. The nitrogen content (the nitrogen concentration) inthe gate insulating film 9 is 0.1 to 10%, for example.

In the gate insulating film 9, the thickness T₂ of a portion (aninsulating film bottom portion 11) located on the bottom surface 8 issmaller than the thickness T₁ of portions (insulating film side portions10) located on the side surfaces 7. More specifically, the ratio(thickness T₂ of insulating film bottom portion 11/thickness T₁ ofinsulating film side portion 10) of the thickness T₂ of the insulatingfilm bottom portion 11 to the thickness T₁ of the insulating film sideportions 10 is 0.3 to 1.0, preferably 0.5 to 1.0. Further specifically,the thickness T₁ of the insulating film side portions 10 is 300 to 1000Å, and the thickness T₂ of the insulating film bottom portion 11 is 150to 500 Å, for example.

A gate electrode 12 is embedded in the gate trench 6 by filling up theinner side of the gate insulating film 9 with a polysilicon materialdoped with an N-type impurity in a high concentration.

On a surface layer portion of the body region 5, N⁺-type source regions13 are formed on both sides of the gate trench 6 in a direction (theright-and-left direction in FIG. 1) orthogonal to the gate width. Thesource regions 13 are doped with an N-type impurity in a higherconcentration than the drain region 4. The source regions 13 have anN-type impurity concentration of 10¹⁸ to 10²¹ cm⁻³, for example. Thesource regions 13 extend in the direction along the gate width onpositions adjacent to the gate trench 6.

The epitaxial layer 3 is provided with P⁺-type body contact regions 14passing through central portions of the source regions 13 in thedirection orthogonal to the gate width from the surface 31 thereof to beconnected to the body region 5. The body contact regions 14 are dopedwith a P-type impurity in a higher concentration than the body region 5.The body contact regions 14 have a P-type impurity concentration of 10¹⁸to 10²¹ cm⁻³, for example.

In other words, the gate trench 6 and the source regions 13 arealternately provided in the direction orthogonal to the gate width, andextend in the direction along the gate width respectively. Boundariesbetween the unit cells adjacent to one another in the directionorthogonal to the gate width are set on the source regions 13 along thesource regions 13. At least one or more body contact regions 14 areprovided over two unit cells adjacent to each other in the directionorthogonal to the gate width. The boundaries between the unit cellsadjacent to one another in the direction along the gate width are so setthat the gate electrode 12 included in each unit cell has a constantgate width.

An interlayer dielectric film 15 made of SiO2 is laminated on theepitaxial layer 3. A contact hole 16 exposing the surfaces of the sourceregions 13 and the body contact regions 14 is formed in the interlayerdielectric film 15 and the gate insulating film 9.

A source wire 17 is formed on the interlayer dielectric film 15. Thesource wire 17 is in contact (electrically connected) with the sourceregions 13 and the body contact regions 14 through the contact hole 16.The source wire 17 has a polysilicon layer 18 in the portion in contactwith the source regions 13 and the body contact regions 14, and has ametal layer 20 on the polysilicon layer 18.

The polysilicon layer 18 is a doped layer made of doped polysilicondoped with an impurity, and preferably a high-concentration doped layerdoped with the impurity in a high concentration of 10¹⁹ to 10²¹ cm⁻³,for example. The impurity for forming the polysilicon layer 18 as thedoped layer (including the high-concentration doped layer) can beprepared from an N-type impurity such as P (phosphorus) or As (arsenic)or a P-type impurity such as B (boron). The polysilicon layer 18 fillsup the contact hole 16. The thickness of the polysilicon layer 18 is5000 to 10000 Å, for example, depending on the depth of the contact hole16.

The metal layer 20 is made of aluminum (Al), gold (Au), silver (Ag) orcopper (Cu), an alloy thereof, or a metal material containing the same,for example. The metal layer 20 forms the outermost layer of the sourcewire 17, and a metal wire or the like, for example, is connected(bonded) thereto. The thickness of the metal layer 20 is 1 to 5 μm, forexample.

In the source wire 17, an intermediate layer 19 containing titanium isinterposed between the polysilicon layer 18 and the metal layer 20. Theintermediate layer 19 is formed by a single layer containing titanium(Ti) or a plurality of layers including the layer. The layer containingtitanium can be prepared from titanium, titanium nitride or the like.The thickness of the intermediate layer 19 is 200 to 500 nm, forexample.

The aforementioned source wire 17 having the polysilicon layer 18, theintermediate layer 19 and the metal layer 20 preferably has a multilayerstructure (Poly-Si/Ti/TiN/Al) obtained by successively laminatingpolysilicon (the polysilicon layer 18), titanium (the intermediate layer19), titanium nitride (the intermediate layer 19) and aluminum (themetal layer 20).

A drain wire 23 is formed on the rear surface 22 of the SiC substrate 2.The drain wire 23 is in contact (electrically connected) with the SiCsubstrate 2. The drain wire 23 has a polysilicon layer 24 in the portionin contact with the SiC substrate 2, and has a metal layer 26 on thepolysilicon layer 24.

The polysilicon layer 24 can be made of a material similar to thatconstituting the aforementioned polysilicon layer 18. The thickness ofthe polysilicon layer 24 is 1000 to 2000 Å, for example.

The metal layer 26 can be made of a material similar to thatconstituting the aforementioned metal layer 20. The metal layer 26 formsthe outermost layer of the drain wire 23, and is bonded to a die pad ofa lead frame when the SiC substrate 2 is bonded to the die pad, forexample. The thickness of the metal layer 26 is 0.5 to 1 μm, forexample.

In the drain wire 23, an intermediate layer 25 containing titanium isinterposed between the polysilicon layer 24 and the metal layer 26. Theintermediate layer 25 can be made of a material similar to thatconstituting the aforementioned intermediate layer 19.

A gate wire 27 is in contact (electrically connected) with the gateelectrode 12 through a contact hole (not shown) formed in the interlayerdielectric film 15.

A prescribed voltage (a voltage of not less than a gate thresholdvoltage) is applied to the gate wire 27 while a prescribed potentialdifference is caused between the source wire 17 and the drain wire 23(between a source and a drain), whereby a channel is formed in thevicinity of the interface between the body region 5 and the gateinsulating film 9 due to an electric field from the gate electrode 12.Thus, a current flows between the source wire 17 and the drain wire 23,and the VDMOSFET is turned on.

FIGS. 2A to 2N are schematic sectional views for illustrating a methodof manufacturing the semiconductor device 1 shown in FIG. 1 in steporder.

First, an SiC crystal is grown on the surface 21 (the Si surface) of theSiC substrate 2 by epitaxy such as CVD (Chemical Vapor Deposition), LPE(Liquid Phase Epitaxy) or MBE (Molecular Beam Epitaxy) while doping thesame with an impurity, as shown in FIG. 2A. Thus, the N⁻-type epitaxiallayer 3 is formed on the SiC substrate 2. Then, a P-type impurity isimplanted into the epitaxial layer 3 from the surface 31 thereof. Whilethe implantation conditions vary with the type of the P-type impurity,acceleration energy is 200 to 400 keV, for example.

Thus, a region (a P-type implantation region 28) into which the P-typeimpurity has been implanted is formed on the surface layer portion ofthe epitaxial layer 3, as shown in FIG. 2B. Due to the formation of theP-type implantation region 28, the drain region 4 isolated from theP-type implantation region 28 while maintaining the state after theepitaxy is formed on the base layer portion of the epitaxial layer 3.

Then, a mask 29 made of SiO2 is formed on the epitaxial layer 3 by CVD,as shown in FIG. 2C. Then, the mask 29 is etched through a photoresistfilm (not shown) into a pattern having openings 30 in regions forforming the body contact regions 14. After the formation of the openings30, a P-type impurity is implanted into the epitaxial layer 3 from thesurface 31 thereof. While the implantation conditions vary with the typeof the P-type impurity, acceleration energy is 30 to 200 keV, forexample. Thus, regions (P⁺-type implantation regions 32) into which theP-type impurity has been implanted in a high concentration are formed ona surface layer portion of the P-type implantation region 28. After theimplantation of the P-type impurity, the mask 29 is removed.

Then, a mask 33 made of SiO2 is formed on the epitaxial layer 3 by CVD(Chemical Vapor Deposition), as shown in FIG. 2D. Then, the mask 33 isetched through a photoresist film (not shown) into a pattern havingopenings 34 in regions for forming the source regions 13. After theformation of the openings 34, an N-type impurity is implanted into theepitaxial layer 3 from the surface 31 thereof. While the implantationconditions vary with the type of the N-type impurity, accelerationenergy is 30 to 200 keV, for example. After the implantation of theN-type impurity, the mask 33 is removed. Thus, a region (an N⁺-typeimplantation region 35) into which the N-type impurity has beenimplanted in a high concentration is formed on the surface layer portionof the P-type implantation region 28.

Then, the epitaxial layer 3 is heat-treated at a temperature of 1400 to2000° C., for example, as shown in FIG. 2E. Thus, the implanted N- andP-type impurities are activated, whereby the body region 5 is formed onthe surface layer portion 3 of the epitaxial layer 3, while the sourceregions 13 and the body contact regions 14 are formed on the surfacelayer portion of the body region 5.

Then, a mask 36 made of SiO₂ is formed on the overall region of thesurface 31 of the epitaxial layer 3 by CVD or thermal oxidation, asshown in FIG. 2F. The mask 36 may alternatively be made of SiN or thelike through CVD.

Then, the mask 36 is etched through a photoresist film (not shown) intoa pattern having an opening 37 in a region for forming the gate trench6, as shown in FIG. 2G.

Then, mixed gas (SF₆/O₂ gas) containing SF6 (sulfur hexafluoride) and O₂(oxygen) is introduced into the surface 31 of the epitaxial layer 3through the opening 37, as shown in FIG. 2H. Thus, the epitaxial layer 3is dry-etched from the surface 31 (the Si surface), and the gate trench6 having the bottom surface 8 having the portion (the Si surface)parallel to the surface 31 and the side surfaces 7 orthogonal to the Sisurface is formed. After the formation of the gate trench 6, the mask 36is removed.

Then, the SiC substrate 2 is introduced into a diffusion furnace, andthe inner surfaces (the side surfaces 7 and the bottom surface 8) of thegate trench 6 and the surface 31 of the epitaxial layer 3 are thermallyoxidized by feeding nitrogen-containing gas while heating the diffusionfurnace, as shown in FIG. 2I. N₂O gas or NO gas, for example, can beemployed as the nitrogen-containing gas. A heater temperature (a heatingtemperature) in the diffusion furnace is 1200 to 1350° C., for example,and a feeding time (an oxidation time) for the nitrogen-containing gasis 3 to 5 hours, for example. The gate trench 6 is formed in theepitaxial layer 3 made of SiC, and hence the oxidation of the innersurfaces of the gate trench 6 progresses under the condition that theoxidation rate for the bottom surface 8 having the Si surface and thatfor the side surfaces 7 orthogonal to the Si surface satisfy thefollowing relational expression:

Oxidation rate for bottom surface 8/oxidation rate for side surface 7<0

Thus, the gate insulating film 9 is formed so that the thickness of theportion (the insulating film bottom portion 11) located on the bottomsurface 8 is smaller than that of the portions (the insulating film sideportions 10) located on the side surfaces 7.

Then, a doped polysilicon material is deposited on the epitaxial layer 3by CVD, as shown in FIG. 2J. The deposited polysilicon material isetched back until the etched-back surface is flush with the surface 31of the epitaxial layer 3. Thus, portions of the polysilicon layerlocated outside the gate trench 6 are removed, and the gate electrode 12is formed by the polysilicon material remaining in the gate trench 6.

Then, the interlayer dielectric film 15 made of SiO2 is laminated on theepitaxial layer 3 by CVD, as shown in FIG. 2K. Then, the interlayerdielectric film 15 and the gate insulating film 9 are so patterned thatthe contact hole 16 exposing the source regions 13 and the body contactregions 14 is formed in the interlayer dielectric film 15 and the gateinsulating film 9.

Then, a polysilicon material 38 is laminated by CVD to fill up thecontact hole 16, as shown in FIG. 2L.

Then, an N- or P-type impurity is implanted into the depositedpolysilicon material, as shown in FIG. 2M. While the implantationconditions vary with the type of the N- or P-type impurity, accelerationenergy is 10 to 100 keV, for example. Thus, the polysilicon layer 18doped with the impurity in a high concentration is formed.

Then, titanium and titanium nitride are deposited in this order on thesurface of the polysilicon layer 18 by a method such as sputtering orvapor deposition to form the intermediate layer 19, as shown in FIG. 2N.Then, aluminum is deposited on the surface of the intermediate layer 19by a method such as sputtering or vapor deposition, to form the metallayer 20. Then, the metal layer 20, the intermediate layer 19 and thepolysilicon layer 18 are worked into a prescribed pattern, to form thesource wire 17. Then, the gate wire 27 connected to the gate electrode12 is formed. Thereafter the drain wire 23 having the polysilicon layer24, the intermediate layer 25 and the metal layer 26 is formed on therear surface 22 of the SiC substrate 2 by a method similar to that forthe source wire 17.

The semiconductor device 1 shown in FIG. 1 is obtained through theaforementioned steps.

In the semiconductor device 1, as hereinabove described, the gate trench6 is dug down from the surface 31 (the Si surface) of the epitaxiallayer 3 made of SiC. Therefore, oxidation of the inner surfaces of thegate trench 6 progresses under the condition that the oxidation rate forthe bottom surface 8 having the Si surface and that for the sidesurfaces 7 orthogonal to the Si surface satisfy the following relationalexpression:

Oxidation rate for bottom surface 8/oxidation rate for side surface 7<0

In the aforementioned method, the inner surfaces of the gate trench 6are thermally oxidized with the nitrogen-containing gas, dissimilarly tothermal oxidation (dry oxidation) employing oxygen gas or thermaloxidation (wet oxidation) employing water vapor (H₂O) gas. Therefore,the ratio (oxidation rate for bottom surface 8/oxidation rate for sidesurface 7) of the oxidation rate for the bottom surface 8 to that forthe side surfaces 7 can be increased as compared with a case where thegate insulating film 9 is formed by dry oxidation or wet oxidation.

In the gate insulating film 9 formed in the aforementioned manner, theratio (thickness T₂ of insulating film bottom portion 11/thickness T₁ ofinsulating film side portion 10) of the thickness T₂ of the insulatingfilm bottom portion 11 to the thickness T₁ of the insulating film sideportions 10 is in the range of 0.3 to 1.0.

Even if the thickness T₂ of the insulating film bottom portion 11 isincreased so that dielectric breakdown can be suppressed, excessiveincrease in the thickness T₁ of the insulating film side portions 10 canbe suppressed due to the lower limit of 0.3 of the ratio (thickness T₂of insulating film bottom portion 11/thickness T₁ of insulating filmside portion 10). When the thickness T₂ of the insulating film bottomportion 11 is designed to a proper value, on the other hand, thethickness T₁ of the insulating film side portions 10 is not excessivelyreduced, due to the upper limit of 1.0. Consequently, dielectricbreakdown of the insulating film bottom portion 11 can be suppressedwhile suppressing increase in the thickness T₁ of the insulating filmside portions 10 by properly designing the thickness T₂ of theinsulating film bottom portion 11.

Further, the gate insulating film 9 consists of the silicon oxynitridefilm formed by thermal oxidation employing the nitrogen-containing gas,whereby channel mobility of the VDMOSFET can be improved.

FIGS. 3A and 3B are schematic plan views of a semiconductor deviceaccording to a second embodiment of the present invention, with FIG. 3Ashowing the overall semiconductor device and FIG. 3B showing an innerportion thereof in an enlarged manner.

A semiconductor device 41 according to the second embodiment of thepresent invention is a trench gate power VDMOSFET (an individual device)employing SiC, in the form of a chip square in plan view, for example.The chip-like semiconductor device 41 has a length of about several mmin the right-and-left (vertical) direction in the plane of FIG. 3A.

The semiconductor device 41 has an SiC substrate 42 and a large numberof unit cells 44 formed on the SiC substrate 42 and partitioned by agate trench 43 latticed in plan view. In other words, the unit cells 44in the form of rectangular parallelepipeds arranged in window portionsof the latticed gate trench 43 respectively are aligned on the SiCsubstrate 42 in the form of a matrix. Each unit cell 44 has a length ofnot more than 10 in the right-and-left (vertical) direction in the planeof FIG. 3B, for example, and a source trench 45, square in plan view,dug down from the surface side toward the side of the SiC substrate 42is formed at the center thereof.

A source pad 46 is formed on the surface of the semiconductor device 41.The source pad 46 is generally in the form of a square having outwardlybent four corners in plan view, and formed to generally cover theoverall region of the surface of the semiconductor device 41. A removedregion 47 is formed in the source pad 46 by partially removing the samein a generally square manner in plan view, on a position slightlyleftward in the right-and-left direction in the plane of FIG. 3A.

A gate pad 48 is arranged on the removed region 47. An interval isprovided between the gate pad 48 and the source pad 46, which areinsulated from each other.

FIG. 4 is a schematic sectional view of the semiconductor device 41according to the second embodiment of the preset invention, taken alonga line IV-IV in FIG. 3B.

The sectional structure of the semiconductor device 41 is described withreference to FIG. 4. The semiconductor device 4 includes the SiCsubstrate 41 of an N⁺-type (having a concentration of 10¹⁸ to 10²¹ cm⁻³,for example). The SiC substrate 42 has a surface 49 (an upper surface)formed by an Si surface and a rear surface 50 (a lower surface) formedby a C surface.

An N⁻-type epitaxial layer 51 made of SiC having a lower concentration(10¹⁵ to 10¹⁷ cm⁻³, for example) than the SiC substrate 42 is laminatedon the SiC substrate 42. The epitaxial layer 51 as a semiconductor layeris formed on the SiC substrate 42 by the so-called epitaxy. Theepitaxial layer 51 formed on the surface 49, i.e., the Si surface, isgrown on a major growth surface formed by an Si surface. Therefore, asurface 52 of the epitaxial layer 51 formed by the growth is an Sisurface, similarly to the surface 49 of the SiC substrate 42.

On the side of the epitaxial layer 51 closer to the surface 52 (the Sisurface), a P-type body region 53 is provided in the form of a well overa wide range, with a concentration of 10¹⁶ to 10¹⁹ cm⁻³, for example. Aregion of the epitaxial layer 51 closer to the SiC substrate 42 (the Csurface) than the body region 53 forms an N⁻-type drain region 54 (adrift region) maintaining the state after the epitaxy.

In the body region 53, an N⁺-type source region 55 (having aconcentration of 10¹⁸ to 10²¹ cm⁻³, for example) is formed generally onthe overall region of the side closer to the surface 52, while a P⁺-typebody contact region 56 (having a concentration of 10¹⁸ to 10²¹ cm⁻³, forexample) is formed on a side (the lower side) closer to the SiCsubstrate 42 than the source region 55. A large number of such bodycontact regions 56 are provided in the form of a matrix.

Source trenches 45 are formed in the same number as the body contactregions 56 so that each source trench 45 passes through each bodycontact region 56, and the latticed gate trench 43 is formed to surroundeach body contact region 56 provided with the source trench 45. Thus,the large number of unit cells 44 functioning as field-effecttransistors respectively are formed on the epitaxial layer 51. In otherwords, the body contact region 56 is formed to surround thecorresponding source trench 45 and the body region 53 is formed tosurround the body contact region 56 in each unit cell 44. A side of thebody region 53 opposite to the side closer to the body contact region 56is exposed on the side surfaces of the gate trench 43. In the unit cell44, the depth direction of the gate trench 43 corresponds to a gatelength direction, and the peripheral direction of each unit cell 44orthogonal to the gate length direction corresponds to a gate widthdirection.

Both of the source trench 45 and the gate trench 43 pass through thebody region 53 from the surface 52 of the epitaxial layer 51 to reachthe drain region 54, and the depths thereof are identical to each otherin the second embodiment. The distance D₁ between side surfaces 59 and57 of the source trench 45 and the gate trench 43 is 0.5 to 3 μm, forexample. When the distance D₁ is in this range, increase in resistance(on-resistance) can be suppressed when each unit cell 44 is turned on,and an electric field applied to the bottom portion of the gate trench43 can be relaxed.

The gate trench 43 is U-shaped in section, such that both end cornerportions 61 of the bottom portion thereof in a direction (a directionopposed to the adjacent unit cell 44) orthogonal to the gate width arebent toward the side of the drain region 54 and the side surfaces 57opposed to each other and a bottom surface 58 are continuous throughbent surfaces. The source trench 45 is also U-shaped in section, suchthat the side surfaces 59 opposed to each other and a bottom surface 60are continuous through bent surfaces. When the unit cell 44 is turnedoff, therefore, the electric field applied to both end corner portions61 of the bottom portion of the gate trench 43 can be dispersed toportions other than both end corner portions 61, whereby a portion (aninsulating film bottom portion 64), described later, of the gateinsulating film 63 located on the bottom surface 58 can be preventedfrom dielectric breakdown.

In the drain region 54, an implantation active layer 62 as animplantation layer formed by implantation of a P-type impurity (B(boron), Al (aluminum) or the like, for example) is formed in a portionreaching an intermediate portion of the gate trench 43 in the thicknessdirection from the bottom surface 58 thereof. The implantation activelayer 62 is in the form of a lattice overlapping with the gate trench 43in plan view, with a width smaller than the distance between the unitcells 44 adjacent to each other. According to the second embodiment, thedepth of the implantation active layer 62 is 0.1 to 0.5 μm, for example.

The implantation active layer 62 is a high-resistance layer havinghigher resistance than the peripheral regions (the drain region 54, forexample), and the resistance thereof is several 10 to several 100 kΩ/□,for example. The implantation active layer 62 has a P-type impurityconcentration of 10¹⁶ to 10²¹ cm⁻³, for example.

A gate insulating film 63 is formed on the inner surfaces of the gatetrench 43, to cover the overall regions thereof. The gate insulatingfilm 63 consists of an oxide film containing nitrogen, such as a siliconoxynitride film formed by thermal oxidation with gas containing nitrideand oxygen, for example. The nitrogen content (the nitrogenconcentration) in the gate insulating film 63 is 0.1 to 10%, forexample.

In the gate insulating film 63, the thickness T4 of the portion (theinsulating bottom portion 64) located on the bottom surface 58 of thegate trench 43 is smaller than the thickness T₃ of portions (insulatingfilm side portions 65) located on the side surfaces 57 of the gatetrench 43, and the ratio (thickness T₄/thickness T₃) of the thickness T₄to the thickness T₃ is 0.3 to 1.0, preferably 0.5 to 1.0. Morespecifically, the thickness T₃ is 300 to 1000 Å, and the thickness T₄ is150 to 500 Å, for example. If the thickness T₃ of the insulating filmside portions 65 is in the aforementioned range, the semiconductordevice 41 can be operated with a proper gate-on voltage, and anefficient transistor operation can be achieved.

A gate electrode 66 is embedded in the gate trench 43 by filling up theinner side of the gate insulating film 63 with a polysilicon materialdoped with an N-type impurity in a high concentration.

An interlayer dielectric film 67 made of SiO2 is laminated on theepitaxial layer 51. A contact hole 68 exposing the surfaces of thesource trench 45 and the source region 55 of each unit cell 44 is formedin the interlayer dielectric film 67 and the gate insulating film 63.

A source wire 69 is formed on the interlayer dielectric film 67. Thesource wire 69 collectively enters the source trench 45 of every unitcell 44 through each contact hole 68, and is in contact with the drainregion 54, the body contact region 56 and the source region 55successively from the bottom side of the source trench 45 in each unitcell 44. In other words, the source wire 69 is common to all unit cells44. An interlayer dielectric film (not shown) is formed on the sourcewire 69, which in turn is electrically connected to the source pad 46(see FIG. 3A) through the interlayer dielectric film (not shown). On theother hand, the gate pad 48 (see FIG. 3A) is electrically connected tothe gate electrode 66 through a gate wire (not shown) drawn onto theinterlayer dielectric film (not shown).

The source wire 69 has a polysilicon layer 70, an intermediate layer 71and a metal layer 72 successively from the side in contact with theepitaxial layer 51.

The polysilicon layer 70 is a doped layer made of doped polysilicondoped with an impurity, such as a high-concentration doped layer dopedwith the impurity in a high concentration of 10¹⁹ to 10²¹ cm⁻³, forexample. The impurity for forming the polysilicon layer 70 as the dopedlayer (including the high-concentration doped layer) can be preparedfrom an N-type impurity such as N (nitrogen), P (phosphorus) or As(arsenic) or a P-type impurity such as Al (aluminum) or B (boron). Thethickness of the polysilicon layer 70 is 5000 to 10000 Å, for example.

According to the second embodiment, the polysilicon layer 70 is formedto cover the overall region of the surface of the unit cell 44 exposedin the contact hole 68, and in contact with the drain region 54, thebody contact region 56 and the source region 55 in the source trench 45.

The layer of the source wire 69 in contact with the drain region 54, thebody contact region 56 and the source region 55 is made of polysilicon,whereby the source wire 69 can be brought into ohmic contact with bothof the body contact region 56 and the source region 55, which arehigh-concentration impurity regions. On the other hand, a heterojunctionhaving a smaller junction barrier than the diffusion potential of a bodydiode 73 (a PN diode formed by junction between the body region 53 andthe drain region 54) intrinsic in the semiconductor device 41 can beformed with respect to the low-concentration drain region 54.

When a current flows to the body diode 73 intrinsic in the semiconductordevice 41, positive holes (holes) moving from the body region 53 to thedrain region 54 recombine with electrons in the drain region 54, and adefect of an SiC crystal in the epitaxial layer 51 may spread in theplane due to the resulting recombination energy. The resistance of thecrystal defect is so high that the crystal defect may hinder an ordinarytransistor operation to increase on-resistance when spreading toward theside of the gate trench 43.

When the heterojunction is formed due to the contact between thepolysilicon layer 70 and the drain region 54 as in the secondembodiment, on the other hand, a current can be fed to the side of theheterojunction in preference to the side of the body diode 73, even if areverse voltage is applied between the source and the drain and thecurrent flows to the aforementioned body diode 73. Consequently, thecrystal defect of SiC can be prevented from spreading, and increase inthe on-resistance can be suppressed.

The intermediate layer 71, laminated on the polysilicon layer 70, isformed by a single layer containing Ti (titanium) or a plurality oflayers including the layer. The layer containing Ti can be prepared fromTi, TiN (titanium nitride) or the like. The thickness of theintermediate layer 71 is 200 to 500 nm, for example.

The metal layer 72, laminated on the intermediate layer 71, is made ofAl (aluminum), Au (gold), Ag (silver), Cu (copper) or Mo (molybdenum),an alloy thereof, or a metal material containing the same, for example.The metal layer 72 forms the outermost layer of the source wire 69. Thethickness of the metal layer 72 is 1 to 5 μm, for example.

More specifically, the polysilicon layer 70, the intermediate layer 71and the metal layer 72 may be combined in a multilayer structure(Poly-Si/Ti/TiN/Al) obtained by successively laminating Poly-Si (thepolysilicon layer 70), Ti (the intermediate layer 71), TiN (theintermediate layer 71) and Al (the metal layer 72).

A drain electrode 74 is formed on the rear surface 50 of the SiCsubstrate 42, to cover the overall region thereof. The drain electrode74 is common to all unit cells 44. The drain electrode 74 has amultilayer structure (Ti/Al) obtained by laminating Ti and Alsuccessively from the side of the SiC substrate 42, for example.

A prescribed voltage (a voltage of not less than a gate thresholdvoltage) is applied to the gate pad 48 while a prescribed potentialdifference is caused between the source pad 46 (the source wire 69) andthe drain electrode 74 (between a source and a drain), whereby a channelis formed in the vicinity of the interface between the body region 53and the gate insulating film 63 due to an electric field from the gateelectrode 66. Thus, a current flows between the source wire 69 and thedrain wire 74, and the VDMOSFET is turned on.

FIGS. 5A to 5U are schematic sectional views for illustrating a methodof manufacturing the semiconductor device 41 shown in FIG. 4 in steporder.

First, an SiC crystal is grown on the surface 49 (the Si surface) of theSiC substrate 42 by epitaxy such as CVD (Chemical Vapor Deposition), LPE(Liquid Phase Epitaxy) or MBE (Molecular Beam Epitaxy) while doping thesame with an impurity, as shown in FIG. 5A. Thus, the N⁻-type epitaxiallayer 51 is formed on the SiC substrate 42.

Then, a P-type impurity is implanted into the epitaxial layer 51 fromthe surface 52 thereof, as shown in FIG. 5B. While the implantationconditions vary with the type of the P-type impurity, accelerationenergy is 200 to 3000 keV, for example.

Then, a mask 75 made of SiO₂ is formed on the epitaxial layer 51 by CVD,as shown in FIG. 5C. Then, the mask 75 is etched through a photoresistfilm (not shown) into a pattern having an opening 76 in a region forforming the body contact region 56. After the formation of the opening76, a P-type impurity is implanted into the epitaxial layer 51 from thesurface 52 thereof. While the implantation conditions vary with the typeof the P-type impurity, acceleration energy is 30 to 400 keV, forexample. After the implantation of the P-type impurity, the mask 75 isremoved.

Then, an N-type impurity is implanted into the epitaxial layer 51 fromthe surface 52 thereof, as shown in FIG. 5D. While the implantationconditions vary with the type of the N-type impurity, accelerationenergy is 30 to 400 keV, for example.

Then, a mask 77 made of SiO₂ is formed on the overall region of thesurface 52 of the epitaxial layer 51 by CVD or thermal oxidation, asshown in FIG. 5E. The mask 77 may alternatively be made of SiN or thelike through CVD. Then, the mask 77 is etched through a photoresist film(not shown) into a pattern having openings 78 in regions for forming thegate trench 43 and the source trench 45. After the formation of theopenings 78, mixed gas (SF₆/O₂ gas) containing SF₆ (sulfur hexafluoride)and O₂ (oxygen) or mixed gas (SF₆/O₂/HBr gas) containing SF₆, O₂ and HBr(hydrogen bromide), for example, is introduced into the surface 52 ofthe epitaxial layer 51 through the openings 78. Thus, the epitaxiallayer 51 is dry-etched from the surface 52 (the Si surface), and thegate trench 43 and the source trench 45 are formed at the same time.Further, the large number of unit cells 44 are formed on the epitaxiallayer 51.

Then, the inner surfaces of the gate trench 43 and the source trench 45are oxidized by thermal oxidation (dry oxidation) employing O₂ gas, asshown in FIG. 5F. Thus, a stopper film 79 is formed. While the thicknessof the stopper film 79 may not be entirely uniform, FIGS. 5F to 5Iillustrate the stopper film 79 having a uniform thickness, for thepurpose of convenience.

Then, a polysilicon material, different from the material (SiO₂) for themask 77 for forming the gate trench 43 and the source trench 45, isdeposited on the epitaxial layer 51 by CVD to completely fill up theoverall regions of the surfaces of the stopper film 79 and the mask 77,as shown in FIG. 5G. Thus, a protective mask 80 is formed on the stopperfilm 79 and the mask 77. The thickness of the protective mask 80 iscontrolled to be 0.1 to 0.5 μm, for example.

Then, the protective mask 80 is etched back from above the epitaxiallayer 51, as shown in FIG. 5H. The protective mask 80 is etched backwhile a portion of the protective mask 80 located on the bottom surface60 of the source trench 45 is masked, until the etching is stopped bythe stopper film 79 and the mask 77. Thus, only a portion of theprotective mask 80 located on the bottom surface 58 of the gate trench43 is removed, while those covering the side surfaces 57 of the gatetrench 43 and the bottom surface 60 and the side surfaces 59 of thesource trench 45 remain.

Then, a P-type impurity is implanted into the epitaxial layer 51 fromthe bottom surface 58 of the gate trench 43 through the stopper film 79,as shown in FIG. 5I. While the implantation conditions vary with thetype of the P-type impurity, acceleration energy is 30 to 400 keV, forexample.

Then, the protective mask 80 is removed and the mask 77 as well as thestopper film 79 are subsequently removed by wet etching, as shown inFIG. 5J.

Thereafter an organic material film 81 is formed on the overall regionof the surface 52 of the epitaxial layer 51, as shown in FIG. 5K. Theorganic material film 81 is made of a material containing carbon, towhich an organic material (polyimide or the like, for example) employedas a photoresist material or the like can be applied, for example. Theorganic material film 81 is formed with a spin coater or the like, forexample.

After the formation of the organic material film 81, the SiC substrate42 is charged into a resistance heating furnace 82. The resistanceheating furnace 82 is not particularly restricted, so far asairtightness in the resistance heating furnace 82 in which a heatedobject is set can be ensured and gas can be introduced thereinto.Further, the heating system of the resistance heating furnace 82 may beeither direct heating or indirect heating.

When the SiC substrate 42 is set in the resistance heating furnace 82,inert gas (N₂, Ar or the like, for example) is introduced into theresistance heating furnace 82, which in turn is subjected totemperature-rise control (first temperature-rise control).

In the first temperature-rise control, the heating temperature iscontrolled to rise from 100° C. to 1000° C. over 35 to 45 minutes, forexample, and thereafter held at 1000° C. (first temperature holding) for5 to 10 minutes, for example, as shown in FIG. 6. Due to the temperaturerise and the temperature holding, elements other than carbon evaporatefrom the organic material film 81, which in turn is altered into acarbon film 83, as shown in FIG. 5L. Therefore, the overall region ofthe surface 52 of the epitaxial layer 51 is covered with the carbon film83.

Then, the resistance heating furnace 82 is subjected to furthertemperature-rise control (second temperature-rise control) while theinner portion thereof is kept in the inert atmosphere.

In the second temperature-rise control, the heating temperature iscontrolled to rise from 1000° C. to 1600° C. over 30 to 60 minutes, forexample, as shown in FIG. 6. After the temperature rise, the heatingtemperature is held at 1600° C. (second temperature holding) for 5 to 10minutes, for example. Due to the temperature rise and the temperatureholding, ions of the individual N- and P-type impurities implanted intoa surface layer portion of the epitaxial layer 51 are activated, and thebody region 53, the source region 55 and the body contact region 56 areformed in response to the implanted portions respectively, as shown inFIG. 5M. Further, the drain region 54 maintaining the state after theepitaxy is formed on a base layer portion of the epitaxial layer 51.

Then, the resistance heating furnace 82 is subjected to temperature-dropcontrol while the inner portion thereof is kept in the inert atmosphere.

In the temperature-drop control, the heating temperature is controlled(temperature-drop-controlled) to drop from 1600° C. to 1300° C. over 15to 30 minutes, for example, as shown in FIG. 6. After the temperaturedrop, nitrogen/oxygen-containing gas is introduced into the resistanceheating furnace 82 for 5 to 10 minutes, for example, while the heatingtemperature is held at 1300° C. (third temperature holding). Due to theintroduction of the nitrogen/oxygen-containing gas, the carbon film 83is oxidized and removed by reacting with oxygen contained in the gas, asshown in FIG. 5N. The introduced nitrogen/oxygen-containing gas can beprepared from gas containing at least N₂O (dinitrogen oxide), and maycontain NO (nitrogen monoxide). The N₂O gas is fed at a flow rate of notmore than 30%, preferably 1 to 30% with respect to the total flow rateof the introduced gas.

Thereafter the heating temperature is further held at 1300° C. (fourthtemperature holding) for 200 to 240 minutes, for example, while thenitrogen/oxygen-containing gas is introduced into the resistance heatingfurnace 82 at the same flow rate. Thus, the surface 52 of the epitaxiallayer 51 is oxidized, and a silicon oxynitride film (the gate insulatingfilm 63) covering the overall region of the surface 52 is formed, asshown in FIG. 5O.

After the formation of the gate insulating film 63, the inert gas (N₂,Ar or the like, for example) is reintroduced into the resistance heatingfurnace 82, while the heating temperature is controlled to drop from1300° C. to 300° C. After the temperature drop, the SiC substrate 42 istaken out from the resistance heating furnace 82.

Then, a doped polysilicon material 84 is deposited from above theepitaxial layer 51 by CVD, as shown in FIG. 5P. The polysilicon material84 is continuously deposited until at least the gate trench 43 and thesource trench 45 are filled up therewith.

Thereafter the deposited polysilicon material 84 is etched back untilthe etched-back surface is flush with the surface 52 of the epitaxiallayer 51, as shown in FIG. 5Q.

Then, only the portion of the polysilicon material 84 remaining in thesource trench 45 is removed by dry etching, as shown in FIG. 5R. Thus,the gate electrode 66 is formed by the polysilicon material 84 remainingin the gate trench 43.

Then, the interlayer dielectric film 67 made of SiO₂ is laminated on theepitaxial layer 51 by CVD, as shown in FIG. 5S.

Then, the interlayer dielectric film 67 and the gate insulating film 63are continuously patterned, whereby the contact hole 68 is formed in theinterlayer dielectric film 67 and the gate insulating film 63, as shownin FIG. 5T.

Then, a polysilicon material is deposited by CVD to fill up the contacthole 68, as shown in FIG. 5U. Thereafter an N- or P-type impurity isimplanted into the deposited polysilicon material. While theimplantation conditions vary with the type of the N- or P-type impurity,acceleration energy is 10 to 100 keV, for example. Thereafter theimpurity is diffused at a temperature of 900° C. for 20 minutes, forexample. Thus, the polysilicon layer 70 doped with the impurity in ahigh concentration is formed. Then, Ti and TiN are deposited in thisorder on the surface of the polysilicon layer 70 by a method such assputtering or vapor deposition, and the intermediate layer 71 is formed.Then, a metal such as Al is deposited on the surface of the intermediatelayer 71 by a method such as sputtering or vapor deposition, and themetal layer 72 is formed. Thus, the source wire 69 is formed. Then, thedrain electrode 74 is formed on the rear surface 50 of the SiC substrate42.

Thereafter the semiconductor device 41 shown in FIG. 4 is obtained byforming the interlayer dielectric film (not shown), the source pad 46and the gate pad 48.

In the semiconductor device 41, as hereinabove described, the gatetrench 43 is dug from the surface 52 (the Si surface) of the epitaxiallayer 51 made of SiC, similarly to the semiconductor device 1 accordingto the first embodiment. Therefore, oxidation of the inner surfaces ofthe gate trench 43 (see FIG. 5O) progresses under the condition that theoxidation rate for the bottom surface 58 having the Si surface and thatfor the side surfaces 57 orthogonal to the Si surface satisfy thefollowing relational expression:

Oxidation rate for bottom surface 58/oxidation rate for side surface57<0

In the aforementioned method, the inner surfaces of the gate trench 43are oxidized not by thermal oxidation (dry oxidation) employing O₂ gasor thermal oxidation (wet oxidation) employing H₂O (water vapor) gas,but by thermal oxidation employing nitrogen/oxygen-containing gas.Further, the implantation active layer 62 into which the P-type impurityhas been implanted is formed immediately under the bottom surface 58 ofthe gate trench 43. Therefore, the ratio (oxidation rate for bottomsurface 58/oxidation rate for side surface 57) of the oxidation rate forthe bottom surface 58 to that for the side surfaces 57 can be increasedas compared with a case where the gate insulating film 63 is formed bydry oxidation or wet oxidation.

In the gate insulating film 63 formed in the aforementioned manner, theratio (thickness T₄/thickness T₃) of the thickness T₄ of the insulatingfilm bottom portion 64 to the thickness T₃ of the insulating film sideportions 65 is in the range of 0.3 to 1.0.

In other words, even if the thickness T₄ of the insulating film bottomportion 64 is increased so that dielectric breakdown can be suppressed,excessive increase in the thickness T₃ of the insulating film sideportions 65 can be suppressed due to the lower limit of 0.3 of the ratio(thickness T₄/thickness T₃). When the thickness T₄ of the insulatingfilm bottom portion 64 is designed to a proper value, on the other hand,the thickness T₃ of the insulating film side portions 65 is notexcessively reduced, due to the upper limit of 1.0. Consequently,dielectric breakdown of the insulating film bottom portion 64 can besuppressed while suppressing increase in the thickness T₃ of theinsulating film side portions 65 by properly designing the thickness T4of the insulating film bottom portion 64.

The gate insulating film 63 consists of the silicon oxynitride filmformed by thermal oxidation employing nitrogen-containing gas, wherebychannel mobility of the VDMOSFET can be improved.

The implantation active layer 62 is formed immediately under the gatetrench 43, whereby an energy barrier formed between the implantationactive layer 62 and the epitaxial layer 51 can be enlarged. Therefore, acurrent can be rendered hardly flowable to the implantation active layer62. Consequently, the electric field concentration on the bottom surface58 of the gate trench 43 can be suppressed.

The source trench 45 is formed at the center of each unit cell 44surrounded by the gate trench 43, whereby congestion of equipotentiallines can be suppressed in the vicinity of both end corner portions 61of the gate trench 43. Consequently, the electric field applied to bothend corner portions 61 on the bottom portion of the gate trench 43 canbe relaxed, whereby the insulating film bottom portion 64 can beprevented from dielectric breakdown.

The source trench 45 may be deeper than the gate trench 43, as in asemiconductor device 85 shown in FIG. 7. Thus, the electric fieldapplied to both end corner portions 61 on the bottom portion of the gatetrench 43 can be further relaxed.

In the semiconductor device 41, the source wire 69 has the polysiliconlayer 70 in the portion in contact with the source region 55 and thebody contact region 56, whereby the same can be brought into ohmiccontact with both of the body contact region 56 and the source region55, which are high-concentration impurity regions.

When the semiconductor device 41 is manufactured, therefore, a step offorming an Ni layer on the surface 52 of the epitaxial layer 51 can beomitted dissimilarly to a case where a layer made of only a metal suchas Al is directly brought into contact with the impurity regions, and astep of silicifying such an Ni layer can also be omitted. Thus, thesurface 52 of the epitaxial layer 51 can be prevented from formation ofa carbon layer.

Consequently, layer peeling can be suppressed between the source wire 69and the epitaxial layer 51. Thus, connection reliability of the sourcewire 69 can be improved.

Further, the layer (the polysilicon layer 70) entering the source trench45 to come into contact with the drain region 54, the body contactregion 56 and the source region 55 is made of polysilicon excellent incoverage, whereby coverage of the source wire 69 can be improved.Consequently, the connection reliability of the source wire 69 can befurther improved.

In addition, the intermediate layer 71 having the multilayer structureof the Ti layer and the TiN layer is interposed between the polysiliconlayer 70 and the metal layer 72. A material containing Ti has excellentadhesiveness with respect to both of a polysilicon material and a metalmaterial. Therefore, adhesiveness between the polysilicon layer 70 andthe metal layer 72 can be improved. Consequently, the connectionreliability of the source wire 69 can be further improved.

When the metal layer 72 contains Al, the TiN layer can be utilized as abarrier layer for preventing diffusion of Al from the metal layer 72into the silicon layer 70, whereby excessive Al can be prevented fromdiffusing into the polysilicon layer 70. Consequently, the impurityconcentration in the polysilicon layer 70 can be stabilized, whereby theresistance of the polysilicon layer 70 can also be stabilized.

An embodiment related to the invention of a method of manufacturing anSiC semiconductor device through a resistance heating furnace is nowdescribed.

FIG. 8 is a schematic sectional view of a planar gate semiconductordevice.

A semiconductor device 101 has a structure obtained by arranging aplurality of unit cells of a planar gate VDMOSFET in the form of amatrix. FIG. 8 shows only part of the plurality of unit cells.

The semiconductor device 101 includes an N⁺-type SiC substrate 102forming the base of the semiconductor device 101. An N⁻-type epitaxiallayer 103 made of SiC (silicon carbide) doped with an N-type impurity ina lower concentration than the SiC substrate 102 is laminated on asurface 121 of the SiC substrate 102. A surface 131 of the epitaxiallayer 103 is constituted of a (0001) plane of SiC, for example.

An N⁻-type drain region 104 maintaining a state after epitaxy is formedon the epitaxial layer 103.

A P-type body region 105 is formed on a surface layer portion of theepitaxial layer 103. A plurality of such body regions 105 (not shown inFIG. 8) are formed at regular intervals to parallelly extend in the samedirection (a direction perpendicular to the plane of FIG. 8), andarranged in a striped manner or in the form of a matrix, for example.The drain region 104 is exposed between two body regions 105 adjacent toeach other.

On a surface layer portion of the body region 105, an N⁺-type sourceregion 106 is formed at an interval from the peripheral edge thereof.

A gate insulating film 107 extending over the drain region 104, the bodyregion 105 and the source region 106 is formed on the surface 131 of theepitaxial layer 103. The gate insulating film 107 is made of SiO₂.

A gate electrode 108 made of polysilicon doped with an N-type impurityin a high concentration is formed on the gate insulating film 107. Thegate electrode 108 is opposed to the drain region 104, the body region105 and the source region 106 through the gate insulating film 107.

An interlayer dielectric film 109 made of SiO2 is laminated on theepitaxial layer 103. A source wire 111 is formed on the interlayerdielectric film 109. The source wire 111 is electrically connected tothe body region 105 and the source region 106 through a contact hole 110formed in the interlayer dielectric film 109.

A gate wire 112 is electrically connected to the gate electrode 108through a contact hole (not shown) formed in the interlayer dielectricfilm 109.

A drain electrode 113 is formed on the rear surface of the SiC substrate102.

When the source wire 111 is grounded and the potential of the gateelectrode 108 is controlled while applying a positive voltage of aproper level to the drain electrode 113, a channel can be formed in thevicinity of the interface between the body region 105 and the gateinsulating film 107 due to an electric field from the gate electrode108. Thus, a current can be fed between the source wire 111 and thedrain electrode 113.

FIGS. 9A to 9L are schematic sectional views for illustrating a methodof manufacturing the semiconductor device 101 shown in FIG. 8 in steporder.

First, the epitaxial layer 103 is formed on the surface 121 of the SiCsubstrate 102 by epitaxy, as shown in FIG. 9A. At this time, a majorgrowth surface (the surface 121) of the SiC substrate 102 is defined bya (0001) plane. Due to the surface 121 of the SiC substrate 102 definedby the (0001) plane, the epitaxial layer 103 formed on the SiC substrate102 by epitaxy is grown also with a major surface defined by a (0001)plane. Therefore, the surface 131 of the epitaxial layer 103 parallel tothe surface 121 of the SiC substrate 102 is defined by the (0001) plane.

Then, a photoresist film 114 having an opening 115 in a portion opposedto a region for forming the body region 105 is formed on the surface 131of the epitaxial layer 103 by well-known photolithography. Then, ions(boron ions, for example) of a P-type impurity are introduced into thesurface 131 of the epitaxial layer 103 from above the photoresist film114. Thus, the P-type impurity is implanted into surface layer portionsof portions of the epitaxial layer 103 exposed from the opening 115, asshown in FIG. 9B.

Then, a photoresist film 116 having an opening 117 in a portion opposedto a region for forming the source region 106 is formed on the surface131 of the epitaxial layer 103 by well-known photolithography. Then,ions (arsenic ions, for example) of an N-type impurity are introducedinto the surface 131 of the epitaxial layer 103 from above thephotoresist film 116. Thus, the N-type impurity is implanted into asurface layer portion (closer to the surface 131 than the portions intowhich the P-type impurity has been implanted) of a portion of theepitaxial layer 103 exposed from the opening 117, as shown in FIG. 9C.

After the implantation of the impurity ions into the surface layerportion of the epitaxial layer 103, an organic material film 118 isformed on the overall region of the surface 131 of the epitaxial layer103, as shown in FIG. 9D. The organic material film 118 is made of amaterial containing carbon, to which an organic material (polyimide orthe like, for example) employed as a photoresist material or the likecan be applied, for example. The organic material film 118 is formedwith a spin coater or the like, for example.

After the formation of the organic material film 118, the SiC substrate102 is charged into a resistance heating furnace 122. The resistanceheating furnace 122 is not particularly restricted, so far asairtightness in the resistance heating furnace 122 in which a heatedobject is set can be ensured and gas can be introduced thereinto.Further, the heating system of the resistance heating furnace 122 may beeither direct heating or indirect heating.

When the SiC substrate 102 is set in the resistance heating furnace 122,inert gas (N₂, Ar or the like, for example) is introduced into theresistance heating furnace 122, which in turn is subjected totemperature-rise control (first temperature-rise control).

In the first temperature-rise control, the heating temperature iscontrolled to rise from 100° C. to 1000° C. over 35 to 45 minutes, forexample, and thereafter held at 1000° C. (first temperature holding) for5 to 10 minutes, for example, as shown in FIG. 6. Due to the temperaturerise and the temperature holding, elements other than carbon evaporatefrom the organic material film 118, which in turn is altered into acarbon film 119, as shown in FIG. 9E. Therefore, the overall region ofthe surface 131 of the epitaxial layer 103 is covered with the carbonfilm 119.

Then, the resistance heating furnace 122 is subjected to furthertemperature-rise control (second temperature-rise control) while theinner portion thereof is kept in the inert atmosphere.

In the second temperature-rise control, the heating temperature iscontrolled to rise from 1000° C. to 1600° C. over 30 to 60 minutes, forexample, as shown in FIG. 6. After the temperature rise, the heatingtemperature is held at 1600° C. (second temperature holding) for 5 to 10minutes, for example. Due to the temperature rise and the temperatureholding, ions of the N- and P-type impurities implanted into the surfacelayer portion of the epitaxial layer 103 are activated, and the bodyregion 105 and the source region 106 are formed on the surface layerportion of the epitaxial layer 103, as shown in FIG. 9F. Further, thedrain region 104 isolated from the body region 105 while maintaining thestate after the epitaxy is formed on a base layer portion of theepitaxial layer 103.

Then, the resistance heating furnace 122 is subjected totemperature-drop control while the inner portion thereof is kept in theinert atmosphere.

In the temperature-drop control, the heating temperature is controlled(temperature-drop-controlled) to drop from 1600° C. to 1300° C. over 15to 30 minutes, for example, as shown in FIG. 6. After the temperaturedrop, oxygen-containing gas is introduced into the resistance heatingfurnace 122 for 5 to 10 minutes, for example, while holding the heatingtemperature at 1300° C. (third temperature holding). Due to theintroduction of the oxygen-containing gas, the carbon film 119 isoxidized and removed by reacting with oxygen contained in theoxygen-containing gas, as shown in FIG. 9G. The oxygen-containing gasintroduced into the resistance heating furnace 122 is preferablyprepared from gas containing oxygen and nitrogen. More specifically, gascontaining NO (nitrogen monoxide) or N₂O (dinitrogen oxide) can beemployed.

Thereafter the heating temperature is further held at 1300° C. (fourthtemperature holding) for 200 to 240 minutes, for example, while theoxygen-containing gas is introduced into the resistance heating furnace122. Thus, the surface 131 of the epitaxial layer 103 is oxidized, andan oxide film 120 covering the overall region of the surface 131 isformed, as shown in FIG. 9H.

After the formation of the oxide film 120, the inert gas (N₂, Ar or thelike, for example) is reintroduced into the resistance heating furnace122, while the heating temperature is controlled to drop from 1300° C.to 300° C. After the temperature drop, the SiC substrate 102 is takenout from the resistance heating furnace 122.

Then, a conductive material film is formed by sputtering. Then, theconductive material film is patterned by well-known photolithography andetching, and the gate electrode 108 is formed on the oxide film 120, asshown in FIG. 9I.

Thereafter the interlayer dielectric film 109 is laminated on theepitaxial layer 103 by CVD (Chemical Vapor Deposition), as shown in FIG.9J.

Then, the contact hole 110 is formed in the interlayer dielectric film109 and the oxide film 120 by well-known photolithography and etching,as shown in FIG. 9K. The remaining portion of the oxide film 120 formsthe gate insulating film 107.

Then, a film of a conductive material is formed on the epitaxial layer103 by sputtering. The conductive material is bonded (deposited) to fillup the contact hole 110 and form a thin film on the interlayerdielectric film 109. Then, the conductive material film formed on theinterlayer dielectric film 109 is patterned by well-knownphotolithography and etching. Thus, the source wire 111 is formed, asshown in FIG. 9L. Further, the gate wire 112 electrically connected withthe gate electrode 108 is formed. In addition, the drain electrode 113is formed on the rear surface of the SiC substrate 102.

The semiconductor device 101 shown in FIG. 8 is obtained through theaforementioned steps.

According to the aforementioned method, the organic material film 118 isheated in the resistance heating furnace 122 by the firsttemperature-rise control after the formation of the organic materialfilm 118 to be altered into the carbon film 119, which is formed on thesurface 131 of the epitaxial layer 103.

After the formation of the carbon film 119, the epitaxial layer 103 isheated due to the second temperature-rise control in the resistanceheating furnace 122 while the inner portion thereof is kept in the inertatmosphere, thereby activating the ions of the N- and P-type impuritiesin the epitaxial layer 103.

Then, the temperature-drop control (temperature drop from 1600° C. to1300° C., for example) is executed while maintaining the resistanceheating furnace 122 in the inert state. Thereafter the oxygen-containinggas is introduced for 5 to 10 minutes, for example, while the heatingtemperature is held at 1300° C. (the third temperature holding). Thus,the carbon film 119 is oxidized and removed, and the surface 131 of theepitaxial layer 103 is exposed.

After the removal of the carbon film 119, the resistance heating furnace122 is subjected to the temperature holding (the fourth temperatureholding) while the oxygen-containing gas is continuously introducedthereinto, whereby the exposed surface 131 is oxidized and the oxidefilm 120 is formed.

The carbon film 119 is formed on the surface 131 of the epitaxial layer103 in advance of the heating (the second temperature-rise control) foractivating the ions, whereby Si escape from the surface 131 can beprevented when the epitaxial layer 103 is heated. Therefore, rougheningof the surface 131 of the epitaxial layer 103 can be suppressed, andplanarity of the surface 131 can be maintained. Consequently, theinterface between the epitaxial layer 103 and the gate insulating film107 can be smoothed, whereby channel mobility of the semiconductordevice 101 can be improved.

Further, the four steps of altering the organic material film 118 intothe carbon film 119 by heating the same (the first temperature-risecontrol), activating the ions by heating the epitaxial layer 103 (thesecond temperature-rise control), oxidizing and removing the carbon film119 with the oxygen-containing gas (the temperature-drop control and thethird temperature holding) and forming the oxide film 120 by oxidizingthe surface 131 of the epitaxial layer 103 (the fourth temperatureholding) can be continuously carried out in the single resistanceheating furnace 122. No apparatus for removing the carbon film 119 orthe like is additionally required, whereby increase in the device costcan also be suppressed. Further, the resistance heating furnace 122 isso employed that the first temperature-rise control, the secondtemperature-rise control, the temperature-drop control as well as thethird temperature holding, and the fourth temperature holding can beprecisely and simply executed.

In addition, the surface 131 of the epitaxial layer 103 on which theoxide film 120 is formed is defined by the (0001) plane, and theoxygen-containing gas introduced into the resistance heating furnace 122is prepared from the gas containing oxygen and nitrogen.

When oxide films are formed by oxidizing (0001) planes of SiC layerswith O₂ gas, H₂O gas (water vapor) and N₂O gas respectively, forexample, MOSFETS including the SiC layers exhibit channel mobilityvalues of 1 to 5 cm²/V·s, 5 to 15 cm²/V·s and 15 to 25 cm²/V·srespectively, for example. In other words, the MOSFET including the SiClayer having the oxide film formed with the N₂O gas is most excellent inchannel mobility.

In the semiconductor device 101 according to the embodiment, the oxidefilm 120 is formed by oxidizing the (0001) plane (the surface 131) ofthe epitaxial layer 103 with NO gas or N₂O gas, whereby the channelmobility of the semiconductor device 101 can be further improved.

EXAMPLES

While the present invention is now described with reference to Exampleand comparative examples, the present invention is not restricted by thefollowing Examples.

Example 1 (N₂O Oxidation)

First, an epitaxial layer made of SiC was formed by growing an SiCcrystal on an Si surface of a wafer-shaped SiC substrate (by Cree Inc.)while doping the same with an N-type impurity. Then, a trench was formedby forming an SiO₂ mask of a prescribed pattern on the surface (an Sisurface) of the epitaxial layer and introducing SF₆/O₂ gas into thesurface of the epitaxial layer through the SiO₂ mask.

Then, the SiC substrate was introduced into a diffusion furnace, and N₂Ogas was fed for 3 hours while heating the diffusion furnace to 1275° C.Thus, an oxide film was formed by oxidizing the inner surface of thetrench.

Other oxide films were formed similarly to the above, by setting thetimes (oxidation times) for feeding N₂O gas to 8 hours and 12 hoursrespectively.

Comparative Example 1 (Dry Oxidation)

Steps similar to those in Example 1 were carried out up to a step offorming a trench. After the formation of the trench, an SiC substratewas introduced into a diffusion furnace, and O₂ gas was fed for 4 hourswhile heating the diffusion furnace to 1150° C. Thus, an oxide film wasformed by oxidizing the inner surface of the trench.

Other oxide films were formed similarly to the above, by setting thetimes (oxidation times) for feeding O₂ gas to 6 hours and 8 hoursrespectively.

Comparative Example 2 (Wet Oxidation)

Steps similar to those in Example 1 were carried out up to a step offorming a trench. After the formation of the trench, an SiC substratewas introduced into a diffusion furnace, and water vapor (H₂O gas) wasfed for 15 minutes while heating the diffusion furnace to 1275° C. Thus,an oxide film was formed by oxidizing the inner surface of the trench.

Other oxide films were formed similarly to the above, by setting thetimes (oxidation times) for feeding H₂O gas to 25 minutes and 35 minutesrespectively.

1) Measurement of Thickness of Oxide Film

The thicknesses of the oxide films formed according to Example 1 andcomparative examples 1 and 2 were measured on portions located on theside surfaces of the trenches and those located on the bottom surfacesof the trenches. FIGS. 10A, 10B and 10C show the results of Example 1and comparative examples 1 and 2 respectively.

2) Thickness Ratio of Oxide Film

The ratios (bottom surface/side surface) of the thicknesses of theportions of the oxide films located on the bottom surfaces to those ofthe portions located on the side surfaces were calculated through thethicknesses of the oxide films shown in FIGS. 10A to 10C respectively.FIGS. 10A to 10C also show the results.

Referring to FIG. 10A, it has been confirmed that the ratios (bottomsurface/side surface) of the thicknesses of the portions of the oxidefilms located on the bottom surfaces to those of the portions located onthe side surfaces were about 0.54 (feeding time: 3 hours), 0.46 (feedingtime: 8 hours) and 0.48 (feeding time: 12 hours) respectively.

Referring to FIG. 10B, it has been confirmed that the ratios (bottomsurface/side surface) of the thicknesses of the portions of the oxidefilms located on the bottom surfaces to those of the portions located onthe side surfaces were about 0.20 (feeding time: 4 hours), 0.20 (feedingtime: 6 hours) and 0.19 (feeding time: 8 hours) respectively.

Referring to FIG. 10C, it has been confirmed that the ratios (bottomsurface/side surface) of the thicknesses of the portions of the oxidefilms located on the bottom surfaces to those of the portions located onthe side surfaces were about 0.23 (feeding time: 15 minutes), 0.21(feeding time: 25 minutes) and 0.22 (feeding time: 35 minutes)respectively.

While the embodiments of the present invention have been described, thepresent invention may be embodied in other ways.

For example, the conductivity types of the semiconductor portions of thesemiconductor device 1, 41 or 85 may be reversed. In other words, theP-type portions may be replaced with N-type portions and vice versa inthe semiconductor device 1, 41 or 85.

Each of the source wire 17 or 69 and the drain wire 23 (the drainelectrode 74) may have a multilayer structure formed by a layer preparedby silicifying nickel (Ni) or titanium (Ti) and the aforementioned metallayer.

While the present invention has been described in detail by way of theembodiments thereof, it should be understood that these embodiments aremerely illustrative of the technical principles of the present inventionbut not limitative of the invention. The spirit and scope of the presentinvention are to be limited only by the appended claims.

What is claimed is:
 1. A method of manufacturing a semiconductor device,comprising: a first step of forming a carbon layer on a surface of afirst conductivity type SiC semiconductor layer which has a sourceforming region and a body forming region, the source forming regioncontaining first conductivity type ions selectively implanted into asurface portion of the body forming region, and the body forming regioncontaining second conductivity type ions selectively implanted into asurface portion of the SiC semiconductor layer; a second step of forminga second conductivity type body region at the surface portion of the SiCsemiconductor layer, of forming a first conductivity type source regionat the surface portion of the body region, and of forming a firstconductivity type drain region at a rear surface side of the SiCsemiconductor layer with respect to the body region, by annealing theSiC semiconductor layer on which the carbon layer is formed, andactivating ions inside the body forming region and the source formingregion; and a third step of removing the carbon layer and forming a gateoxide film on the surface of the SiC semiconductor layer.
 2. The methodof manufacturing a semiconductor device according to claim 1, whereinthe third step is performed in gas containing at least one of NO andN₂O.
 3. The method of manufacturing a semiconductor device according toclaim 1, wherein the first step includes a step of forming an organicmaterial layer on the surface of the SiC semiconductor layer andaltering the organic material layer into the carbon layer by heating theorganic material layer.
 4. The method of manufacturing a semiconductordevice according to claim 3, wherein a polyimide is used as the organicmaterial layer.
 5. The method of manufacturing a semiconductor deviceaccording to claim 1, further comprising a step of forming a gate trenchso as to penetrate the source forming region and the body forming regionfrom the surface of the SiC semiconductor layer before the first step,wherein the third step includes a step of forming the gate oxide film onan inner surface of the gate trench such that a ratio (a firstthickness/a second thickness) of the first thickness of a portionlocated on a bottom surface of the gate trench to the second thicknessof a portion located on a side surface of the gate trench is 0.3 to 1.0.6. The method of manufacturing a semiconductor device according to claim5, further comprising a step of embedding a polysilicon into the gatetrench until the gate trench is filled up with the polysilicon.
 7. Themethod of manufacturing a semiconductor device according to claim 6,further comprising a step of performing an etchback to partially removethe polysilicon until an etchback surface of the polysilicon is flushwith the surface of the SiC semiconductor layer.
 8. The method ofmanufacturing a semiconductor device according to claim 1, furthercomprising a step of forming a source contact wiring so as to form anohmic contact with the source region, wherein the step of forming thesource contact wiring includes a step of forming a polysilicon layer ata contact portion between the source region and the source contactwiring.
 9. The method of manufacturing a semiconductor device accordingto claim 8, further comprising a step of forming a source trench so asto penetrate the source forming region and the body forming region fromthe surface of the SiC semiconductor layer before the first step. 10.The method of manufacturing a semiconductor device according to claim 9,wherein the step of forming the source contact wiring includes a step ofembedding the polysilicon layer into the source trench until the sourcetrench is filled up with the polysilicon layer.
 11. The method ofmanufacturing a semiconductor device according to claim 8, furthercomprising a step of implanting at least one of a first conductivitytype impurities or a second conductivity impurities into the polysiliconlayer.
 12. The method of manufacturing a semiconductor device accordingto claim 1, wherein the third step includes a step of forming the gateoxide film such that a nitrogen content in the gate oxide film is 0.1 to10%.
 13. The method of manufacturing a semiconductor device according toclaim 3, wherein the third step includes a step of oxidizing andremoving the carbon layer by introducing oxygen-containing gas andforming the gate oxide film by oxidizing the surface of the SiCsemiconductor layer, and the first step, the second step and the thirdstep are continuously performed in a single resistance heating furnacewithout removing the SiC semiconductor layer from the heating furnace.14. The method of manufacturing a semiconductor device according toclaim 3, wherein the step of altering the organic material layer intothe carbon layer includes a step of holding a heating temperature of theorganic material layer at a first temperature for a first predeterminedtime.
 15. The method of manufacturing a semiconductor device accordingto claim 14, wherein the second step includes a step of holding theheating temperature at a second temperature higher than the firsttemperature for a second predetermined time.